Intel has reached a major milestone in the production of quantum chips for a new era of high performance computing. At Intel’s Gordon Moore Park in Hillsborough, Oregon, Intel Labs and Components Research has achieved the highest level of silicon spin-qubit device manufacturing through extreme ultraviolet lithography (EUV). The company’s engineers have created quantum chips with extraordinary “homogeneity”, providing 95% performance across the entire 300mm silicon wafer.
The testing of the second-generation chip sparked discussion of the company’s progress in quantum chip manufacturing. Intel’s new quantum devices were selected using Cryoprober, which operates at very low temperatures to keep the qubits stable and allow them to be used for computational purposes.
The company’s engineers were able to achieve 95% performance across the entire 300mm silicon wafer.
This time, 95% of the company’s chips were selected correctly. It is worth noting that earlier all the efforts of the company were limited to isolated cases. Thus, EUV technology is now suitable for the production of many quantum chips on a wafer, providing high results. At the same time, Intel continues to work on quantum computers that could work stably at room temperature. The company understands that this is very important for a promising industry in the future.
Once the development of the second generation test chip is completed, Intel will try to optimize this process by building on the progress already made to target the next generation. The main challenge is to be able to produce quantum chips with millions of qubits, which is currently in the early stages of development.
